DC - Digit Concept

DC - Digit Concept

Worldwide Leader in IC DECAPSULATION equipment’s, over 30 years of experience, we provide the right tool and recipe for full or part Decapsulation, Bonding cut, Cross Sectioning, … by ACID, LASER, PLASMA, MECHANICAL with Artifact Free. SESAMEACID SESAMEPLASMA included iMIP 2022 release SESAMELASER SESAMEMECHANICAL iPanel™ UP-GRADE or TRADE-IN your old equipment with the last technics … with … New iPanel™ and Options See our last research presented at IPFA, ISTFA, ESREF - New method for decapsulation of copper wire devices using LASER and sub-ambient temperature chemical etch - Comparative Study on Decapsulation for Copper and Silver Wire-Bonded Devices - Aluminum Corrosion on Integrated circuits after chemical decap using an automatic wet-etch, root cause and containment - New front side access approach with Plasma decapsulation for low-k dielectric/Cu technologies in plastic package - Microelectronics Failure Analysis using Laser Ablation of Composite Materials in System in Package - Decapsulation of Silver-Alloy Wire-Bonded Devices Have a fruitful ISTFA2022 with DIGIT CONCEPT :)